Multi-functional substrate platform for smart sensor with wireless interface applications

Project coordinator ﹙project consortium﹚ Poland:
prof. Ryszard S. Jachowicz, Singapore: Shan Xue Chuan, Ph.D.

Partners of the consortium ﹙partner, country﹚
SIMTech, Singapore Institute of Manufacturing Technology, Singapore and Warsaw University of Technology, Poland

Aim of project
The realization of the research project concerning wireless system interface for smart microsensors/microsystems has a number of beneficial aspects for both partners of the joint Singapore-Poland cooperation. It results from complementary knowledge and experience of both the Singapore Institute of Manufacturing and Technology (SIMTech) and Warsaw University of Technology, Microsystems and Sensors Research Group (WUT). For the Polish partner, it is extremely important to have access to hi-tech technologies applied in microelectronics — printing/imprinting of metal, dielectric and semiconductor layers on elastic and rigid (LTCC — Low Temperature Co-fi red Ceramic) substrates. For the Singapore partner, it is valuable to cooperate with a Polish group which has experience in terms of microsensors/microsystems construction and design, especially in the new area of wireless interfaces for microsystems and microsensors design launched 5 years ago.

Expected results
The subject of the research can be described as two principal issues:
Construction, design, modelling, simulation and building with full characterization of universal wireless interface for microsensors and microsystems;
Development of selected technological processes required for building interface and microsensor structure on elastic and rigid substrates, as well as printing/imprinting methods.