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We are shaping the future of European semiconductor technologies

Opublikowano: 14/04/2026 2:44 pm

Signing of the cooperation agreement between CEZAMAT and CEA‑Leti

The Warsaw University of Technology’s Centre for Advanced Materials and Technologies (CEZAMAT) and CEA‑Leti – one of Europe’s leading research institutes in micro‑ and nanoelectronics – have signed a cooperation agreement. This partnership marks a concrete step toward developing cutting‑edge technologies and strengthening Europe’s technological sovereignty.

The agreement was signed by Prof. Mariusz Malinowski, Vice‑Rector for Research at the Warsaw University of Technology, and Jean‑René Lèquepeys, Deputy Director of CEA‑Leti.

The agreement establishes long‑term cooperation in microelectronics, photonics and microsystems, based on joint technology development and concrete research and development activities. The collaboration will focus in particular on the joint development and implementation of FD‑SOI technologies, the advancement of radiation‑hardened (rad‑hard) technologies, cooperation on advanced microelectronic solutions, the development of IoT technologies and their applications, and the strengthening of the position of FD‑SOI within the European ecosystem.

During the event, Prof. Mariusz Malinowski, Vice‑Rector for Research at the Warsaw University of Technology, Etienne de Poncins, Ambassador of France to Poland, and Dariusz Standerski, Secretary of State at the Ministry of Digital Affairs, highlighted the strategic importance of French‑Polish cooperation and the need to support the development of secure and competitive semiconductor technologies in Europe.

Since the late 1990s, the Warsaw University of Technology has been actively developing SOI technologies, working, for example, with INPG (Francis Balestra, Sorin Cristoloveanu) and participating in projects such as SINANO and NONSIL. Today we continue along this path through the FAMES Pilot Line coordinated by CEA‑Leti and through work on new initiatives within the EU Chips 2.0 programme (RESOLVE).

Representatives of the Warsaw University of Technology and of CEA‑Leti